Qualms About Quantum: New Export Controls Advanced Tech Aligns US Policies With Allied Countries
On September 6, 2024, the US Department of Commerce’s Bureau of Industry and Security (BIS) introduced an interim final rule that imposed worldwide export controls on slew of advanced technologies to align with the Implemented Export Controls (IEC) of international partners.
Read the interim rule here.
Continued Efforts to Align Export Controls With Allies
The new IEC rule is the US government’s latest effort to sync its export control polices with that of allied countries. We previously wrote about a proposed rule by the US State Department to strengthen the Australia-United Kingdom-United States (AUKUS) by introducing a new exemption under the International Traffic in Arms Regulations (ITAR), and the final rule went into effect on September 1, 2024. But while Directorate of Defense Trade Controls (DDTC) eased licensing requirements to better align with US allies, BIS is pursuing the same goal but doing the exact opposite: expanding export controls over items related to quantum computing, chipmaking, and additive manufacturing.
Changes to Commerce Control List (CCL)
The new rule adds 18 new Export Control Classification Numbers (ECCNs) and revises nine existing ones on the Commerce Control List (CCL) as follows:
- New ECCNs: 2B910, 2D910, 2E903, 2E910, 3A901, 3A904, 3B903, 3B904, 3C907, 3C908, 3C909, 3D901, 3D907, 3E901, 3E905, 4A906, 4D906, and 4E906.
- 3B001 expanded: paragraphs c.1.a, c.1.c, and q added to ECCN 3B001. Accordingly, the associated software and technology is now also controlled under ECCNs 3D001, 3D002, and 3E001.
- Other ECCNs revised: 2E003, 3A001, 3C001, 4D001, and 4E001.
See below for our list of the newly controlled items, which are described under the new ECCNs plus the expanded 3B001, 3D001, 3D002, and 3E001. These items are subject to worldwide licensing requirements (yes, you read that correctly) for national security and regional stability reasons. License applications will be reviewed under a presumption of approval for destinations in Country Group A:1, a presumption of denial for Country Groups D:1 or D:5, and a case-by-case basis for everywhere else.
Newly Controlled Items
The new ECCNs added to the CCL are as follows:
New ECCN |
Description of Controlled Item |
Reason for Controlled Status |
---|---|---|
2B910 Associated software: 2D910 Associated technology: 2E910 |
Additive manufacturing equipment, designed to produce metal or metal alloy components. |
Controlled equipment is used to parts and components in military devices, such as aircraft, missiles, and propulsion systems. |
2E903 |
Technology for the development or production coating systems. |
Protects the erosion of the structural integrity and mechanical strength of gas turbine engines. |
3A901 Associated software for paragraph b: 3D901 Associated technology: 3E901 |
a. Complementary Metal Oxide Semiconductor (CMOS) integrated circuits, not elsewhere controlled, designed to operate at an ambient temperature equal to or less than 4.5 K. b. Parametric signal amplifiers exceeding certain ambient operating ambient temperature, frequency, and noise figure thresholds. |
Improves the performance of quantum processors which require extremely low operating temperatures. |
3A904 Associated technology: 3E901 |
Cryogenic cooling systems and components. |
Facilitates research on quantum systems with a larger quantity of physical qubits. |
3B903 Associated software: 3D901 Associated technology: 3E901 |
Scanning Electron Microscope (SEM) equipment designed for imaging semiconductor devices or integrated circuits. |
Can be used to reverse engineer integrated circuits and perform chip design recovery. |
3B904 Associated software: 3D901 Associated technology: 3E901 |
Cryogenic wafer probing equipment. |
Used to scale up quantum computing and increase speed up testing and characterization compared to traditional low-temperature testing. |
3C907 Associated technology: 3E901 |
Epitaxial materials consisting of a “substrate” having at least one epitaxially grown layer and containing isotopic enriched silicon and germanium. |
Key materials needed to develop spin-based quantum computers. |
3C908 Associated technology: 3E901 |
Fluorides, hydrides, chlorides, of silicon or germanium, containing other specified materials |
Key materials needed to develop spin-based quantum computers. |
3C909 Associated technology: 3E901 |
Silicon, silicon oxides, germanium, or germanium oxides, containing any other specified materials |
Key materials needed to develop spin-based quantum computers. |
3D907 |
Software designed to extract and process Graphic Design System II (GDSII) or equivalent standard layout data.
|
Aids in the reverse engineering of integrated circuits. An example of an equivalent standard would be Open Artwork System Interchange Standard (OASIS). |
3E905 |
Technology for the development or production of integrated circuits or devices, using “Gate all-around Field-Effect Transistor (GAAFET) structures. |
Produces chips that are more efficient, capable, and tolerant to radiation and thus enables more robust artificial intelligence and other military and commercial applications. |
4A906 Associated software: 4D906 Associated technology: 4E906 |
Quantum computers and related electronic assemblies and components therefor. |
Represents a high level of technological sophistication warranting national security, regional stability, and anti-terrorism controls. |
In addition, BIS also added paragraphs c.1.a, c.1.c, and q to 3B001 (and in doing so, also expanded the scope of the associated software and technology controlled by 3D001 and 3E001, respectively):
c.1. Equipment designed for dry etching as follows:
c.1.a. Equipment designed or modified for isotropic dry etching, having a largest `silicon germanium-to-silicon (SiGe:Si) etch selectivity’ of greater than or equal to 100:1.
c.1.c. Equipment designed or modified for anisotropic dry etching, having all the following:
c.1.c.1. Radio Frequency (RF) power source(s) with at least one pulsed RF output.
c.1.c.2. One or more fast gas switching valve(s) with switching time less than 300 milliseconds.
c.1.c.3. Electrostatic chuck with 20or more individually controllable variable temperature elements
q. “EUV” masks and “EUV” reticles, designed for integrated circuits … and having a mask “substrate blank” ….
ECCNs 2E003, 3A001, 3C001, 4D001, and 4E001 have been updated to contain references to the newly controlled items.
Exceptions, Exclusions, and General Licenses
License Exception IEC
The interim final rule introduces License Exception IEC, allowing exports, re-exports, and transfers of the newly controlled items to countries whose export control policies are sufficiently similar to the United States. The initial list of eligible destinations can be found here. We are unsurprised to see that it consists of close Western European allies, plus Australia and Japan.
Deemed Export Exclusions
To minimize disruption to industry, BIS has excluded certain deemed exports and deemed reexports from the new controls:
- Grandfathering Clause – Foreign persons employees who already have access to newly controlled technology and software and remain employed as of September 6, 2024, will not have to obtain a license. Does not apply to the release of GAAFET technology controlled under ECCN 3E905 to a foreign person whose most recent country of citizenship or permanent residency is within Country Group D:1 or D:5 (but see GAAFET license below).
- Full exclusion for ECCNs 3D001, 3D002, and 3E001 technology and software related to dry etching equipment controlled by 3B001.c.1.a and c.1.
- Limited exclusion for ECCNs 2D910, 2E910, 3D001, 3D901, 3D907, 3E001, 3E901, 3E905, 4D906, and 4E906. New licensing requirements do not apply to deemed exports and reexports, unless foreign person’s most recent country of citizenship or permanent residency is within Country Group D:1 or D:5.
Two General Licenses
Two general licenses — one for GAAFET and one for quantum technology — aim to facilitate US collaboration with allied partners in those areas. Both can be found under new General Order No. 6 at EAR Part 736, Supplement No. 1, and both come with annual reporting requirements.
The GAAFET license authorizes the export, re-export, or transfer of GAAFET technology described under ECCN 3E905 to end users in Country Group A:5 and A:6 for the development or production of integrated circuits that began before September 6, 2024. The license also covers deemed exports and reexports to foreign employees who most recently were citizens or permanent residents of D:1 or D:5 countries.
The second general license allows deemed exports and reexports of software and technology for quantum items (described under ECCNs 3D901, 3E901, D906, and 4E906) to foreign persons whose most recent country of citizenship or permanent residency is in D:1 or D:5. This license recognizes that the “United States will continue to rely on foreign talent to fill critical workforce gaps” in quantum information science and technology.
- Related Practices